Description
Core Electronics for Ethernet-APL Field Devices
Rapid Integration of Ethernet-APL Communication and Application into Field Devices
commModule APL is a cost-effective hardware module for the implementation of Ethernet-APL field devices. It provides connectivity to Ethernet-APL as well as an application software that can be easily configured to implement the required behavior of the particular field device. Existing HART and Modbus devices can be migrated to Ethernet-APL even without the need to write a single line of code. All required mapping to the HART or Modbus commands can be defined using the commScripter tool.
Fast and cost-effective implementation
- Small footprint for use in majority of process equipment
- Suited for automatic assembly on motherboard
- No need for a complex hardware development
- No stack porting, no application programming
PROFINET protocol software according to PA profile 4.02 already onboard
- Implementation follows latest APL and PI specifications
- Run-time license for the software is already included
Made for intrinsically safe hardware designs
- Potted and non-potted version for optimized ex design
- ATEX and IECEx approval for use in explosive environments
Easy integration into HART and Modbus devices
- Script-controlled mapping of function block application to device specific HART or Modbus commands
- No need for C programming
- commScripter tool checks script and creates mapping table
- Off-the-shelf commModules are customized by downloading mapping table
| Hardware | |
| Processor | Renesas RX64M |
| RAM | 2,5 MByte |
| Flash | 4 MByte (on chip) |
| Non-volatile RAM | On chip for persistent storage of parameters |
| Connectors | Solder pads on edge of PCB |
| Current Consumption | 50 mA |
| Power Supply to Device | 3.2 V (max. 70 mW) and 6.2 V (max. 90 mW) |
| Operating Temperature | -40 °C … +80 °C |
| Storage Temperature | -40 °C … +125 °C |
| Relative Humidity | 10 % … 90% non condensing |
| Mounting | Soldering (automatic assembly possible for non-potted version) |
| Weight | 15 g (pottet), 8 g (non-potted) |
| Dimensions | 32,0 x 54,7 x 8,0 mm |
| Interfaces | |
| Fieldbus Interface | PROFINET over APL with PA Profile 4.02 |
| Interface to Application Device | for regular firmware for commKit: UART, for user specific firmware: UART, I2C, SPI |
| Protocol to Application Device | HART, Modbus (coming soon) or user specific |
| Certificates | |
| ATEX | In preparation |
| IECEx | In preparation |
| Scope of Delivery | |
| Hardware | Preliminary engineering samples of commModule APL available on request Production devices on tray (sealed dry pack) available later this year |
| Firmware | PROFINET device stack, mapping application |
| Documentation | Hardware Manual |
| Order Numbers | |
| EIA-AS-022430 | commModule APL potted, samples |
| EIA-AS-022450 | commModule APL non-potted, samples |